SX5500VM Handler

SX5500VM is specially designed for new emerging packages such as BGA,QFN, CSP with fine pitches(0.3mm) and high ball counts. With new cutting edge technology, Synax has
developed the vision alignment mode and the loadcell control system(Patented) that caters to most testing requirements in the world today.

Features Available:

- Ambient and High Temp Testing

- Vision Alignment Mode
Using vision alignment for correction of package position prior to insertion into test socket ensures optimum package alignment between IC balls and contact element of socket.

- Loadcell Control System (Patented)
Test hand compression on device is designed with feedback-controlled load system and hence minimizes device damage. This feature is specially catered for ultra thin packages (less than 0.5mm).

- Flexiblity
Varieties of packages size acceptable 2mmx2mm ~ 60mmx60mm.

- Fine Pitch Devices
Capable of handling a minimum of 0.3mm pitch balls.

- Cost Saving
i) Enhanced socket durability by reducing socket wear.
ii) Reduce socket maintenance time.

- Guaranteed High 1st Pass Yield