SYNAX latest 2010 development
- S9
Low in cost and high in performance. Easy operation and maintenance.
Specifications:
Device
type: |
BGA,CSP,BCC,MLF,QFN,QFP |
Device
size: |
3.0×3.0mm
~ 50×50mm(depend on socket) |
Index
time: |
Less
than 0.35sec. |
Throughput: |
up to
8500 (Depend on condition) |
Contact
Layout: |
Matrix
: 4x2 Pitch : 40x60mm |
Contact
Mode: |
1~8ch |
Jam
rate: |
1/20,000 |
Option: |
- Kitless
- ATC |
|